FusionAP Sdn Bhd (Pre-Seed)
Funding Details
Awarder
SemiNews
Date Award
May 13, 2026
Vertical
Advanced Semiconductor Packaging
Funding URL
View Funding Page
Funding Amount
$2,000,000
Company Info
Founding Year
2025
Organizations Involved
Intel, TSMC, Malaysia Science Endowment
Founders
Ooi Teng Chow, Peter Chavart
Market
Semiconductor Industry
Location
Penang, Malaysia
Coinvestors
Vertex Ventures Southeast Asia & India, Southern Capital Group
Company Description

FusionAP is a Malaysia‑based advanced packaging company specializing in next‑generation semiconductor packaging technologies. Working closely with a global ecosystem of design houses, foundries, and technology partners, FusionAP enables 2.5D, 3D, and future‑ready packaging solutions. From early prototyping through high‑volume production, FusionAP delivers a trusted, geopolitically neutral OSAT solution for advanced packaging innovation.

Links
Website
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