RAAAM Memory Technologies (Series A)
Funding Details
Awarder
SemiNews
Date Award
November 4, 2025
Vertical
Semiconductor
Funding Amount
$17,500,000
Company Info
Founding Year
2021
Traction
RAAAM has already demonstrated its GCRAM technology on silicon of leading foundries and has announced a close collaboration with NXP.
Organizations Involved
NXP Semiconductors, IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, J-Ventures, Silicon Catalyst Ventures, Serpentine Ventures
Founders
Robert Giterman, Eli Leizerovitz
Market
On-chip memory solutions
Location
Petach Tikva, Israel
Coinvestors
NXP Semiconductors, IAG Capital Partners, EIC Fund, LiFTT, Alumni Ventures, J-Ventures, Silicon Catalyst Ventures, Serpentine Ventures
Company Description

RAAAM has developed GCRAM, the next-generation on-chip memory technology in the semiconductor industry, providing up-to 50% area reduction and up-to 10X power reduction over high-density SRAM. RAAAM’s patented GCRAM technology can be manufactured in any standard CMOS process and can be used by semiconductor companies as a drop-in replacement for SRAM, enabling a larger on-chip memory capacity in a smaller silicon area and reduced power and cost.

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