晶能 (Series A)

Funding Details
Awarder
SemiNews
Date Award
June 19, 2023
Vertical
Power Semiconductors
Funding URL
View Funding Page

Company Info
Organizations Involved
Geely Capital, Xiamen Jianfa, Chunshan Capital, Qingkong Merchants, PwC Capital, China-US Green Fund, Guxin Holdings, Zhonghe Wanfang, Xiangtan Chanxing
Company Description
晶能 is a company specializing in power semiconductor design, research, module manufacturing, and on-vehicle applications. They have completed their second round of financing with existing investor Gaorong Capital leading the round. Other participating institutions include Geely Capital, Xiamen Jianfa, Chunshan Capital, Qingkong Merchants, PwC Capital, China-US Green Fund, Guxin Holdings, Zhonghe Wanfang, and Xiangtan Chanxing. The company expresses gratitude to professional investors led by Gaorong founding partner Yue Bin for their strong support. 晶能 will continue to solidly advance the design, research, and manufacturing of power semiconductors according to established goals.
Location
China
Coinvestors
Geely Capital, Xiamen Jianfa, Chunshan Capital, Qingkong Merchants, PwC Capital, China-US Green Fund, Guxin Holdings, Zhonghe Wanfang, Xiangtan Chanxing

Links
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