Funding Details
- Awarder
- SemiNews
- Date Award
- June 13, 2024
- Vertical
- Semiconductors
- Funding URL
- View Funding Page
Company Info
- Founding Year
- 2022
- Organizations Involved
- Nanya, UMTC, Ibiden, Shinko, SEMCO, Simmtech, 深南电路 (Shennan Circuit), 安捷利美维 (AJL), 珠海越亚 (Zhuha YUEYA), 兴森快捷 (Xingsen Kuaijie)
- Founders
- 谷新 (Dr. Xie Xin), 卢中 (Lu Zhong), 蔡琨辰 (Cai Kunchen)
- Company Description
- 芯承半导体有限公司 specializes in providing integrated circuit packaging substrate solutions. The company's focus is on high-density flip-chip chip packaging substrate mass production, utilizing innovative processing technologies such as MSAP, ETS, and SAP to develop FC CSP, FC BGA substrate with 10/10μm line width/spacing capabilities. They have already achieved production of WB CSP, FC CSP, SiP substrates with L/S 15/15 lines and are working towards increasing FC CSP, FC BGA production capacity.
- Market
- Semiconductor Packaging Materials
- Location
-
Zhongshan,
China
- Coinvestors
- 鼎晖百孚 (Dinghui Baifu)
Links