TeraSi (Pre-Seed)

Funding Details
Awarder
SemiNews
Date Award
August 15, 2023
Vertical
Wireless Components and Packaging
Funding URL
View Funding Page

Company Info
Founding Year
2020
Traction
TeraSi’s goal is to implement the first system-in-package modules based on their technology and bring them to market alongside their unique passive components. The company plans to expand their engineering team, invest in new manufacturing infrastructure, and pursue an aggressive IP strategy.
Founders
James Campion
Company Description
We make components and packaging for the next generation of wireless.
Market
6G Communication Network
Location
Stockholm, Sweden
Coinvestors
Navigare Ventures, Almi Invest, Onsight Ventures, Deeptech Labs

Links
Back to Home Back to Wireless Components and Packaging Deals View Funding Announcement