Funding Details
- Awarder
- SemiNews
- Date Award
- June 12, 2024
- Vertical
- Semiconductor Equipment
- Funding URL
- View Funding Page
Company Info
- Founders
- 周玮 (Zhou Wei)
- Company Description
- 苏州芯睿科技有限公司 (CoreShell Technologies) specializes in the research and development of semiconductor wafer bonding equipment, focusing on temporary and permanent bonding solutions for compound semiconductors. With over a decade of experience, their products cover various semiconductor fields, supporting processes ranging from 2 to 12 inches. They have provided nearly a hundred compound semiconductor bonding equipment and introduced temporary bonding and debonding equipment for 2.5D/3D packaging in 2023.
- Market
- Semiconductor Industry
- Location
-
Suzhou,
Jiangsu,
China
- Coinvestors
- 临芯资本, 华方资本, 冯源资本, 云锦资本, 深圳高新投, 卓源资本
Links