Company Description

苏州芯睿科技有限公司 (CoreShell Technologies) specializes in the research and development of semiconductor wafer bonding equipment, focusing on temporary and permanent bonding solutions for compound semiconductors. With over a decade of experience, their products cover various semiconductor fields, supporting processes ranging from 2 to 12 inches. They have provided nearly a hundred compound semiconductor bonding equipment and introduced temporary bonding and debonding equipment for 2.5D/3D packaging in 2023.