Funding Details
- Awarder
- PlugAndPlayTechCenter
- Date Award
- May 15, 2024
- Funding URL
- View Funding Page
Company Info
- Company Description
- Crystal Sonic develops innovative semiconductor materials processing technologies that reduce waste and drive down the manufacturing cost of next generation chips. Our core technology, Sonic Lift-off, harnesses the power of sound to separate chips from wafers with no material loss, enabling the re-use of wafers. In replacing wasteful legacy approaches and lowering manufacturing cost, Sonic Lift-off will accelerate the adoption of next-generation high efficiency and high-performance compound semiconductors that will transform our energy, computing, communications, and sensing technologies infrastructure for decades to come.
Links