Spoonfuls (Accelerator)

Funding Details
Awarder
PlugAndPlayTechCenter
Date Award
May 15, 2024
Funding URL
View Funding Page

Company Info
Company Description
the first and only patented spoon-cap package with ‘flip and go’ technology delivering a packaging solution poised to disrupt the marketplace with multi-use functionality and ergonomic design for unsurpassed convenience.

Links
Back to Home View Funding Announcement